News

5 June 2006

 

OMI releases new thermal deformation analysis software suite

Optical Metrology Innovations (OMI), located in Cork, Ireland and a supplier of metrology tools for strained silicon and advanced semiconductor packaging, has released an upgrade to the thermal analysis software provided with its Equinox system. The software is also available as an offline version. It allows users to visualize the thermal properties of semiconductor packages.

The new formats include deformation and strain/shear color maps with user selectable transparency, a programmable mesh format similar to a typical FEM environment and CTE color maps for analysis of anisotropic materials. The upgrade also includes a stitching algorithm for larger samples and an additional mode to enable the measurement of samples without underfill. Users can select various combinations of the available formats to create a viewing mode suitable to the sample being measured or issue being analyzed.

Visit: http://www.optical-metrology.com

Contact: [email protected]