News: Microelectronics
16 June 2020
Anokiwave adds ex-Broadcom and ex-MACOM wireless industry leaders to board
As one of several strategic investments is making to achieve its aggressive growth objectives, Anokiwave Inc of San Diego, CA, USA – which provides highly integrated silicon core chips and III-V front-end integrated circuits for millimeter-wave (mmW) and active antenna-based 5G communications, mobile satellite communications, and aerospace & defense markets – has expanded its board to nine directors by appointing two wireless industry executives (effective 7 May): Bryan Ingram, formerly senior VP & general manager of Broadcom’s Wireless Semiconductor Division (WSD), and Michael T. Murphy, formerly senior VP & general manager of MACOM’s RF and Microwave Business. The additions bring more than 50 years of combined operational expertise, a track record of success with development and production of high-growth, high-volume RF and handset products, and industry relationships that are both broad and deep, says Anokiwave.
“Given how 5G mmW infrastructure buildout will have a high-volume aspect similar to that of Wi-Fi access points and handset modules, their industry expertise is highly valued,” says CEO Robert S Donahue. “The knowledge and experience Bryan and Mike bring, along with the expertise of our other board members and employees, will accelerate Anokiwave’s transformation into the industry’s most successful commercial-volume supplier of highly integrated mmW silicon core ICs for some of the fastest-growing markets in the entire electronics industry,” he reckons.
Ingram has a background in RF/MW engineering management, semiconductor operations, and new product development. At Broadcom, he oversaw the development, production and marketing of RF components for handsets and other devices. Earlier, he was chief operating officer of Avago Technologies, where he led the legacy Avago business units and operations. Prior to Avago’s founding from the Agilent Semiconductor Products Group (SPG) in 2005, he was VP & general manager of the SPG Wireless Semiconductor Division. Before that, he held management positions at Hewlett Packard and Westinghouse. Ingram has a B.S. in Electrical Engineering from the University of Illinois and an M.S. in Electrical Engineering from Johns Hopkins University.
Prior to being senior VP & general manager of MACOM’s RF and Microwave business, Murphy was its senior VP of engineering. He led all worldwide engineering sites and was responsible for new technology development, product development and product engineering. Prior to joining MACOM, he was VP of engineering, Networks, and Standard Products at TriQuint Semiconductor, where he led all new product development teams and activities across the business unit’s six design centers. Previously, he was director of TriQuint’s New England Design Center following the firm’s acquisition of Infineon Technologies’ gallium arsenide (GaAs) business unit. In 1999, Murphy proposed and founded a US-based GaAs IC design center in Nashua, NH for Infineon Technologies GmbH of Munich, Germany. Before that he served in MACOM’s GaAs MMIC business in design engineering, engineering management and product line management for multi-function ICs for mobile phone and Wi-Fi applications. He began his career as a microwave design engineer at Raytheon Company. Murphy has a B.S. and M.S. in Electrical Engineering from University of Massachusetts, Amherst and an M.B.A. from Boston University. He was previously a member of Anokiwave’s board of advisors.
