AIM Photonics announces best-in-class 300mm silicon photonics MPW performance

The American Institute for Manufacturing Integrated Photonics (AIM Photonics) - an industry-driven, public-private United States Department of Defense (DoD)-sponsored engineering technology consortium, spearheaded by the State University of New York Polytechnic Institute (SUNY Poly) - has announced a number of technical updates leading to what is reckoned to be best-in-class 300mm silicon (Si) photonics-based multi-project wafer (MPW) performance.

Complementing these developments, AIM Photonics’ Si photonics process design kit (PDK) continues to advance, as a result of its library of both active and passive high-performance photonic components as well as interfaces, schematics and models for the development of optical modules and systems.

“Our best-in-class MPW offerings are a testament to our deep bench of experts and collaborators who support our more than 100 signed partners and other interested collaborators,” says Dr Michael Liehr, AIM Photonics’ CEO and SUNY Poly executive VP for Innovation and Technology. “Combined with our recent announcement that our multi-project wafer processing time has decreased from 130 days in 2016 to fewer than 90 days, AIM Photonics remains focused on achieving impactful, world-class quality and repeatability to drive development and commercialization of the advanced technologies that will shape our world.”

AIM Photonics’ MPW performance is the result of new, ultra-low-loss waveguides, featuring attenuation that is less than 0.25dB/cm and 0.10dB/cm for 220nm silicon and 220nm silicon nitride (SiN), respectively, in addition to around 1dB/facet edge coupler for both transverse electric (TE) and transverse magnetic (TM) polarization. With only 90-day fabrication time for full actives to be processed on 300mm silicon on insulator (SOI) wafers, and using the same toolset that produces 14nm and smaller circuits, these capabilities also enable easy transfer to similar high-volume equipped foundries if needed.

The MPW also features fusion bonding of the photonic integrated circuit (PIC) and an active interposer to allow for the entire design area to be utilized for photonics or metal routing, in addition to lasers that can be soldered into pockets and deep trenches for coupling. As part of the MPW offering, AIM Photonics’ passive interposer also features a 100µm-thick silicon substrate with a through-silicon-via (TSV) SiN waveguide with three front-side and one back-side metal wiring levels, in addition to pockets for laser and PIC chips, which can be flip-chip soldered in deep trenches for edge or evanescent fiber coupling.

With a comprehensive set of silicon PIC component libraries and by leveraging SUNY Poly’s process capabilities, AIM Photonics’ PDK now consists of more than 50 reliable photonics components, including passive components such as waveguides, edge couplers and layer transitions, in addition to active devices such as C-, C+L- and O-band photodetectors; microdisk switches and modulators; thermo-optic phase shifters and switches; and variable optical attenuators (VOAs), among others, that are verified by university and industry experts. Combined with data that can be obtained from a 14nm toolset to validate designs, this information can also help those working with AIM Photonics to achieve the desired performance.

Key features of the latest AIM Photonics Analog Photonics/SUNY PDK include:

O-band modulation, detection and coupling support;
C+L-band modulation, detection, filtering, switching, monitoring and coupling support;
single-level and multi-level modulation format support at 50Gbps, namely NRZ and PAM-4; and
continued multi-vendor electronics-photonics design automation (EPDA) support with integrated EPDA PDK flow for hierarchical design and system-level simulation.

AIM Photonics says that the combined PDK and MPW offering provides access to PIC systems for all customers, especially small- to medium-size companies, that desire a reduction in the time to market, as well as lower product development risk and investment. By incorporating design, verification and process development within the PDK, such companies can quickly and efficiently modify their designs as they simultaneously reduce their cost per gigabit.

“Companies operating within the integrated photonics space face a number of challenges as they seek to provide cost-effective, high-quality products,” says Dr Douglas Coolbaugh, AIM Photonics’ chief operating officer & SUNY Poly associate VP for Photonics Development. “With AIM Photonics’ continually updated PDK, as well as our best-in-class, cost-effective MPW that offers a broad component library, we are thrilled to assist the industry, and especially small- and medium-sized enterprises, with the capabilities and technical expertise they require to provide innovative and timely solutions to current technological challenges.”

AIM Photonics will also be offering new incentives to parties interested in the most recent upcoming MPW runs. These are available at booth #4425 (Hall EF, North) during the SPIE Photonics West 2019 event in San Francisco (5–7 February) or can be requested from AIM Photonics by e-mailing the MPW team at [email protected].

AIM Photonics is leveraging SUNY Poly’s facilities for three total full-build/passive MPW runs that incorporate the latest PDK, with on-demand Active/Passive PIC; Passive PIC; Passive Interposer; and Active Interposer MPW runs scheduled throughout 2019. To ensure space for all interested parties, AIM Photonics is accepting reservations for these MPW runs. Interested parties can also sign up for the 2019 runs by visiting the AIM Photonics’ website.

PDK and MPW fab access is solely available through the AIM Photonics MPW aggregator MOSIS.

See related items:

AIM Photonics unveils support for datacom and telecom optical bands with new silicon photonics PDK

AIM Photonics and Analog Photonics unveil silicon photonics PDK

AIM Photonics releases integrated silicon photonics PDK

Tags: silicon photonics PICs

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Visit: www.aimphotonics.com/mpw-schedule