6 March 2017

MACOM increasing bandwidth density in optical networks for 100G, 400G-and-beyond

In booth #1736 at the Optical Fiber Communication Conference & Exposition (OFC 2017) in Los Angeles (21-23 March), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) will debut a newly expanded portfolio of optoelectronics and photonic solutions.

Product demonstrations at OFC (by appointment in booth #1736) include:

• an OSA (optical subassembly) solution for 100G CWDM4;
• a PAM-4 L-PIC (lasers integrated with silicon photonic integrated circuits) transmitter;
• a 100G PAM-4 53GBaud PHY with driver and transimpedance amplifier (TIA);
• a 64 GBaud quad linear modulator driver; and
• a SFP28 long-reach chipset.

MACOM staff will also give the following presentations:

19 March (3:30–6:30pm, Room # 408B)
‘III-V + Silicon: To Integrate or to Co-package?’ - MACOM's Rich Grzybowski will serve as a panelist, discussing the prospects and challenges of heterogeneous integration in silicon photonics.

20 March (1:30–3:50/4–6pm)
‘Overcoming the Challenges in Large-Scale Integrated Photonics’ - MACOM's Roe Hemenway will address market opportunities for integrated photonic modules in data centers and other traditional application spaces.

20 March (4:30–5:45pm)
‘Fireside Chat: Growth & Profitability in Optical Networking - Boom and Bust or Sustainable?’ - MACOM's Preet Virk will participate in this OSA Executive Forum Panel addressing growth and profitability in Optical Networking.

23 March (3–6pm)
‘Component Suppliers’ Vision’ - MACOM’s Bart Zeydel will participate in this OIF Workshop addressing potential electrical link and interconnect technologies being developed to support serial data rates of 100Gb/s and higher.

Tags: Wolfspeed

Visit: http://2017.satshow.com

Visit: www.wolfspeed.com/RF