- News
20 September 2011
Infinera to scale next-generation InP PICs with Aixtron MOCVD system
Deposition equipment maker Aixtron SE of Herzogenrath, Germany says that in first-quarter 2011 it received an order for an AIX 2600G3 IC metal-organic chemical vapor deposition (MOCVD) system from new customer Infinera Corp of Sunnyvale, CA, USA, a vertically integrated manufacturer of digital optical network systems incorporating its own indium phosphide-based photonic integrated circuits (PICs). Capable of growing 49x2-, 12x4- or 7x6-inch wafers, the reactor will be used for next-generation InP PICs following delivery in third-quarter 2011 and commissioning by Aixtron’s local support teams.
“We were looking for the world’s foremost MOCVD system to provide a foundation for the fabrication and scaling of our next-generation PICs,” says Dr Fred Kish, senior VP, Optical Integrated Circuit Group at Infinera. “The Aixtron MOCVD system will be of significant importance not only in development but also in production of these challenging indium phosphide circuits,” he adds. “Their systems have the highest reputation and capabilities and include precise epitaxy control, excellent run uniformity as well as scalability for guaranteed future proofing. Couple that with the excellent support service and we were certain the AIX 2600G3 IC deposition system uniquely suited our needs.”
Infinera’s PICs integrate more than 60 functions on two chips for use in the long-haul (LH) dense wavelength division multiplexed (DWDM) optical transport network (OTN) market. The firm says that its systems and PIC technology currently provide customers with simpler and more flexible engineering and operations, faster time-to-service, and the ability to rapidly deliver differentiated services. Most recently, it has demonstrated next-generation PICs capable of both 500Gb/s and 1Tb/s data rates, implemented on two monolithic InP chips that integrate more than 600 functions.
Aixtron MOCVD Infinera InP PICs
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