1 November 2011

EVG launches ZoneBOND-capable equipment and open platform for temporary bonding materials

EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, has launched a suite of temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND technology.

ZoneBOND technology is said to provide an approach for temporary wafer bonding, thin wafer processing, and debonding applications that overcomes the last remaining limitations associated with thin wafer processing. It allows the use of silicon, glass and other carriers, is compatible with existing, field-proven adhesive platforms, and enables debonding at room temperature with virtually no vertical force being applied to the device wafer. To support grinding and backside processing at high temperatures and to allow for low-force carrier separation, ZoneBOND defines two distinctive zones on the carrier wafer surface with strong adhesion in the perimeter (edge zone) and minimal adhesion in the center zone. Therefore, only low separation force is required for carrier separation once the polymeric edge adhesive has been removed by solvent dissolution or other means.

EVG says that its new EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules can be easily integrated in the firm’s high-volume manufacturing equipment platforms such as the EVG850 Series automated temporary bonding and debonding systems. The modules will begin shipping to industrial customers before the end of 2011. Already, earlier this year, Germany’s Fraunhofer IZM ASSID (All Silicon System Integration Dresden) received EZR and EZD modules for ZoneBOND processes and materials qualification as part of a joint development agreement with EVG.

In parallel to the launch of the modules, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials. Through an open materials platform approach, EVG aims to establish a stronger supply chain for its TB/DB technologies. It plans to qualify a wide range of adhesives from various materials suppliers for the ZoneBOND process. In support of this effort, EVG has defined standard test procedures that allow for fast and reliable qualification of additional adhesives. The firm says that it will soon disclose the initial, new materials suppliers supporting the ZoneBOND process.

“Integrating ZoneBOND technology into our field-proven, high-volume temporary bonding/debonding platform is an important part of EVG’s efforts to not only ensure our customers have access to the most advanced technology available, but also to continue driving the commercialization of 3D ICs,” says Markus Wimplinger, corporate technology development and IP director. “A key advantage of our EZR and EZD modules is their ability to support a variety of adhesive materials, which in turn provides our customers with increased flexibility during thin wafer processing,” he adds.

*EVG and Brewer Science Inc of Rolla, MO, USA (which manufactures specialty materials, process solutions and equipment for the microelectronics industry) have announced an agreement that will enable both firms to commercialize ZoneBOND technology for customers in the temporary wafer bonding market.

“Combining Brewer Science's advanced material development and process integration and EVG's field-proven equipment and process solutions, ZoneBOND will enable customers to achieve a quantum leap in thin wafer processing,” reckons EV Group’s executive technology director Paul Lindner.

Tags: EVG Bonding Brewer Science

Visit: www.EVGroup.com

Visit: www.brewerscience.com